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      Products > Polishing wafer > polishing wafer

      polishing wafer

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      polished wafer Specifications


      Thickness(μm) TTV(μm)TIR(μm)BOW(μm)WARP(μm)LLS(ea)
      FZ-Si-polished waferSingle side polished wafer150-1500≤5≤5≤20≤20<10@0.3μm
      Double sides polished wafer150-1500≤5≤5≤20≤20<10@0.3μm
       CZ-Si-polished
      wafer
      Single side polished wafer150-1500≤5≤5≤20≤20<10@0.3μm
      Double sides polished wafer150-1500≤5≤5≤20≤20<10@0.3μm

      Note:If customer has any special requirements on geometrical parameters, we can process accordingly.

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